Customer Details

Customer Name: *

Company Name: *

Phone: *

Fax:

E-Mail: *

Tape Details

Current Tape:

Tape Size: Width *
Length *

Current Problem / Status / Process Information: *

Material Details

Wafer Material: *

Wafer Size: *

Thickness before Grind: *

Thickness after Grind: *

Surface Condition (Topography):

Final End Product:

Bumps (if any)

Pattern:

Material:

Size in Microns:

Pitch in Microns:

Distance in Microns:

Height in Microns:

Backgrind Tape Laminator

Current Laminator (Make/Model):

UV Exposure Condition (In case UV tape is used.)

UV irradiation equipment:

Power Output (mW/cm²):

Nitrogen Purge (Y/N):

UV Wavelength (Ex. 365nm):

Backgrinding

Backgrind Equipment (Make/Model):

Thinning method (Include all methods used):

Thinning Chemicals Used (if applicable):

NOTES:

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