Customer Name: *

Company Name: *

Phone: *

Fax:

E-Mail: *

Current Die Bonding Tape or Epoxy Paste:

Tape Size: Width *           
Thickness: *   

Process Information:

Wafer Material: *

Wafer Size: *

Ringframe Size: *

Final Wafer Thickness: *

Die Adherent Condition:
Material:
Surface Roughness:

Substrate Adherent Condition:
Material:
Surface Roughness:

Wire Material (Only necessary for over-wire LE-Tape):

Wire Loop Height:

Final End Product:

Current Wafer Mounter:

Die Size (min.):

Die Size (max.):

Cutting Depth Into the Tape:

Blade Width:

Current Dicing Machine:

UV Light Source (if any):

Power Output (mW/cm2², mJ/cm²):

Nitrogen Purge (Y/N):

UV Wavelength (Ex. 365nm):

Picking Process Equipment:

How Much Expansion (mm):

Ejecting Y/N (needle):

Required Reliability Level:

Surface resistivity:

Volume resistivity:

Wafer Starts/Month:

Location of Manufacturing:

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