Customer Name: *

Company Name: *

Phone: *

Fax:

E-Mail: *

Current Backside coating method:

Tape Size: Width *           
Thickness: *   

Process Information:

Wafer Material: *

Wafer Size: *

Ringframe Size: *

Final Wafer Thickness: *

Grinded Surface Roughness: *

Final End Product:

Current Wafer Mounter:

Die Size (min.):

Die Size (max.):

Cutting Depth Into the Tape:

Blade Width:

Current Dicing Machine:

Picking Process Equipment:

How Much Expansion (mm):

Ejecting Y/N (needle):

Required Reliability Level:

Surface resistivity: *

Volume resistivity: *

Wafer Starts/Month:

Location of Manufacturing:

Security code

Please enter the security code (case sensitive!)::

I accept the Privacy Policy.

send