Customer Name: *

Company Name: *

Phone: *

Fax:

E-Mail: *

Current Tape:

Tape Size: Width *                 
Length / Sheet: *

Current Problem / Status / Process Information: *

Wafer Material: *

Wafer Size: *

Ringframe Size: *

Final Wafer Thickness: *

Surface Adherent Condition:
Material:
Surface Roughness description:

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Wafer Mounter Model:

Dicing method -laser,saw etc:

Fullcut or scribe:

Die Size (min.):

Die Size (max.):

Cutting Depth Into the Tape:

Blade Width:

Current Dicing Machine:

UV irradiation equipment:

Power Output (mW/cm2², mJ/cm²):

Nitrogen Purge (Y/N):

UV Wavelength (Ex. 365nm):

Picking Process Equipment:

How Much Expansion (mm):

Ejecting Y/N (needle):

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