Laminator
Cutting-Edge advanced lamination system for thin wafer to achieve tension free Back Grinding Tape lamination.
RAD-3520F/12 (300mm Fully-Automatic BG Tape Laminator)
1. Unique tape lamination format
This laminator is mounted with the very latest TTC* system (patent registered) for preventing bow or damage to ultra-thin wafers. Capable of high precision tension control during tape lamination, the equipment substantially reduces residual stress to thin wafers after back grinding.
*TTC (Tape Tension Control) System : The TTC is a cutting-edge system, in which a microcomputer controls tape tension. It enables the tape to be laminated according to the tape type and back-end processing conditions. On the fully-automatic type, tape application torque and torque curve can be set and registered with the equipment's touch screen.
2. Use of a multi-joint robotic arm
Features a multi-joint robotic arm (patent application completed) for wafer handling and tape cutting within the laminator. In tape cutting, a high precision cutting surface is obtained through accurate control of cutter angles, with no problems during back grinding.
3. High operability realized
A high degree of operability is realized through improvements in the functions on the dialogue-type touch panel located on the front of the equipment. Each type of lamination condition can be set.
| Options: |
- Host communication function (communication format: conforms to SECS-I and HSMS/Software: conforms to GEM)
- Double cassette loading
- Wafer box loading
- Wafer ID reader
- Special Modification for 4&6inch capability
- Hand Barcode Reader
- UPH: 70 wafers/hour (100 wafers/hour with high-speed specification)
|
RAD-3500m/12 (300mm Semi-Automatic BG Tape Laminator）
1. Compactly designed high performance laminator
It is suitable for small-lot production in the assembly process as well as research and development. While capable of handling 300mm wafers, the equipment's compact design allows the effective use of workspace.
2. Suitable for thin wafers
TTC system enables back grinding tape to be laminated on the wafer without applying stress. Hence, the laminator can also be used for processing thin wafers.
*TTC (Tape Tension Control) System : The TTC is a cutting-edge system, in which a microcomputer controls tape tension. It enables the tape to be laminated according to the tape type and back-end processing conditions. On the fully-automatic type, tape application torque and torque curve can be set and registered with the equipment's touch screen.
3. Easy-to-operate semi-automatic type
Once the wafer is set on the mounting table, the back grinding tape can be automatically laminated and cut with simple control inputs.
