Peeler
LINTEC's advanced Back Grinding Tape Peeler systems that peels tapes with a minimal stress on wafer.
RAD-3010F/12 (300mm Fully-Automatic BG Tape Remover)
1. Ideal tape peeling
An ideal 180-degree peeling technique is used when peeling Back Grinding Tape from the wafer. The technique minimizes stress to the wafer while the tape is peeled, allowing the equipment to process thin wafers.
2. Elimination of damage to wafer circuit surface
Peeling tape is thermo-compression bonded to the Back Grinding Tape within 3mm from the wafer's periphery. This greatly reduces residual adhesive as well as damage to the wafer circuit surface usually caused by peeling tape lamination.
3. Outstanding cost performance
Peeling tape consumption does not vary with wafer size making for economical operation. Moreover, the peeling tape is of the thermo-compression type, ensuring secure lamination regardless of the presence of silicon dust on the Back Grinding Tape.
4. Automatic control of UV intensity and quantity of light
The equipment's built-in sensor provides feedback control to maintain constant UV intensity and quantity of light. This means a uniform level of UV intensity throughout the lamp's service life, ensuring stable tape peeling even when using UV curable Back Grinding Tape.
| Options: |
- Host communication function
(communication format: conforms to SECS-I and HSMS/Software: conforms to GEM)
- Barcode reader for selecting recipes
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RAD-3020F/12 (300mm Fully-Automatic BG Tape Peeler)
1. Stress on the wafer during peeling is reduced with the new peeling method
Using the latest heat seal peeling method, peeling tape is thermo-compression bonded to the Back Grinding Tape within 3mm from the wafer’s periphery, and the Back Grinding Tape is peeled from the wafer at a 180-degree angle. This minimizes the stress to the wafer. Having the new peeling method achieves a more stable peeling.
2. Back Grinding Tape peeling is performed without any contact with the wafer backside
By using our unique wafer holding table, Back Grinding Tape peeling is performed without any contact with the wafer backside.
3. Adopts backside non-contact wafer handling method
By adopting the non-contact wafer backside handling method, contamination caused by contact is eliminated for wafers with specially shaped backside used in the manufacturing processes of power devices and TSV.
| Options: |
- Host communication function (communication format: conforms to SECS-I and HSMS/Software: conforms to GEM)
- Compatible with clean room applications, and suitable for front-end process
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RAD-3000m/12 (300mm Semi-Automatic BG Tape Remover）
1. Compactly designed high performance remover
This equipment is suitable for small-lot production in the assembly process as well as research and development. While capable of handling 300mm wafers, the equipment's compact design allows the effective use of workspace.
The equipment is compatible with both wafer and wafer mounted to ring frame.
2. Stable removing of BG Tape
Similar to the fully-automatic type, peeling tape is thermo-compression bonded to the back grinding tape within 3mm from the wafer's periphery, and it is peeled from the wafer at a 180-degree angle. This minimizes the stress to the wafer, allowing the processing of thin wafers.
3. Easy-to-operate semi-automatic type
Once the wafer is set on the peeling table, the peeling tape can be laminated and the back grinding tape removed automatically with simple control inputs.
