RAD-2600F/12 (300mm Fully-Automatic Remounter）

 
1.Fully-automatic wafer remounter
RAD-2600F/12 is a revolutionary new concept developed by LINTEC Corporation.
The fully-automatic wafer remounter was developed to safely remount wafers
on a ring-frame.

2. Remounting process
The workpiece (wafer on tape and ring-frame) is loaded to RAD-2600F/12. In the first step, the workpiece is UV irradiated and aligned by use of a high-tech camera system.
Afterwards, the workpiece is transferred to the attachment table where the cutting process is performed. Once the cutting of the initially mounted tape is completed, the ring-frame is removed and a new tape is mounted on the wafer. In the last step, the initially mounted tape is peeled off. After wafer-ID reading and barcode labeling, the remounted workpiece is unloaded to the frame-cassette.

Using this method, even the most fragile material can be safely handled without contact to or damage of critical wafer-structures. In particular, several specific features of
RAD-2600F/12 contribute to achieving the most secure wafer processing:
• Tape cutting with a high precision 6-axis robot
• Wafer-remounting on only one table - no transfer between tape cutting and
mounting unit
• Camera alignment function available in several modes (frame only, wafer
centering only, wafer centering with V-notch orientation, pattern alignment)
• Mounting accuracy measurement system
• 300 mm and 200 mm frame handling, double-robot without end-effector change
• Supporting wafer thicknesses down to 40μm before or after die singulation
(suitable for standard dicing, DBG, SDBG and PDBG)