S series - Peeling Tape for BG Tape removal

1. A special-purpose tape for removing Back Grinding Tape with the Wafer Mounter RAD-2500 series and the BG Tape Remover RAD-3000 series.

2. This tape, used in combination with each equipment, allows the removal of Back Grinding Tape without damaging the wafer.

3. Regardless of the Back Grinding Tape's material, the peeling tape is securely adhered by thermo-compression bonding, allowing the complete removal of the Back Grinding Tape.

B series - Label for Clean Room Use

This is a tracking label best suited for clean room use. The line-up also includes heatproof label material that features outstanding heat resistance, solvent resistance, and abrasion resistance properties.